It is the chip that has to compete with the A16 Bionic of the normal iPhone 15 and with the Snapdragon 8 Gen 2, as well as with Samsung’s Exynos 2200, but for reasons we did not know Mediatek kept dragging it out with strange excuses. Well, the worst rumors, the most serious, have ended up exploding. And it is that The Mediatek Dimensity 9300 has a serious problem with temperatureto the point where the company is already asking assemblers for certain measures in the form of a firmware update to lower the frequency and voltage.
It was expected to compete with the Snapdragon 8 Gen 3 and with him A17 Bionic from Apple, but little by little everything is cooling down in terms of expectations, at the same rate, it seems, that temperature problems arise. And the new Mediatek SoC is pissing off many phone manufacturers, first because of time, second because of resources and third, because the cooling systems cannot handle the Taiwanese option.
A different design, a temperature problem, a fiasco for Mediatek and its Dimensity 9300
The Dimensity 9200 was already a disappointment. It couldn’t beat the Snapdragon 8 Gen 2, but also by a lot, and for this reason, this new SoC was the hope of the brand, which seems to be stuck in a hole and not reaching bottom. The latest rumors come from the leaker who revealed the peculiar configuration of this chip, and where curiously its problems come from.
And, to put it into perspective, the Dimensity 9300 is a SoC with an unusual configuration for a smartphone, hence a bit of the “hype” it created: 4 fast and 4 Ultra fast Cores (Cortex-A720 and Cortex-X4). Manufactured in the TSMC N4 lithographic node, Mediatek promised them very happy, having managed to exclude the efficiency cores, which would push this SoC to very high performance levels, practically TOP.
Nothing could be further from the truth. The Mediatek Dimensity 9300 has temperature problems and this is leaving a significant trail of complaints among OEMs.
It will not perform as it should, the frequencies have to be lowered
If Apple and Qualcomm do what they do, if Intel even on the desktop is going to compete with ARM with the E-Core to improve general efficiency of the CPUs, Mediatek’s path is going to leave them alone, because AMD is also mounted on the same ship than the rest.
In fact, the temperature problem of Mediatek Dimensity 9300 It is of such caliber that there are reports of conversations with OEMs and clients with the brand on this topic. The company would have already told them that performance figures were not going to be able to be achievedbecause the engineering samples of the first phones to implement it are so hot that they are burning the hands of the beta testers, who they can’t hold it.
The solution, given the cost of development and production, will be a firmware that will limit frequencies and voltage to keep the SoC at a safe temperature and that it does not have a negative impact on the telephones. Therefore, the performance is not going to be what it should be and Mediatek is in a difficult point, since there would already be two SoCs with poor performance, in addition, followed over time, which encourages its rivals to take each more and more advantage in the market. The next bullet? The new 3nm SoC that will arrive at the end of next year.